In the PCBA processing process, due to process or manual factors, a small amount of tin balls and dross may be left on the printed circuit board assembly. The tin beads and tin dross will detach in an uncertain environment, shorting out the PCBA board, and eventually causing the product to fail.
The following are some measures to reduce PCBA tin beads and dross:
1. Watch the production of stencil. It is necessary to properly adjust the opening size in conjunction with the specific component layout of the PCBA board to control the printing volume of solder paste. Especially for some dense pedestrian components or the board surface components are more dense.
2. For PCB bare boards with BGA, QFN and dense base components on the board, strict baking action is recommended to ensure moisture on the pad surface is removed, to maximize soldering ability and prevent the generation of tin beads. Get more Box Build Assembly
3. Inn hand soldering work chambers, clean the countertop in time, and strengthen the visual inspection of the SMD components around the manually soldered components, focus on checking whether the solder joints of the SMD components are accidentally touched and dissolved or the tin balls and dross are scattered among the component pins.
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